Copper Plating Processes
- Process Overview
Engineering High-Performance Conductive Undercoats and Levelling Layers
Copper plating is essential for achieving deep-pore penetration, exceptional thermal and electrical conductivity, and flawless micro-levelling prior to decorative or engineering finishes. Whether used as a high-throwing-power strike layer on active substrates like steel and zinc die-castings, or as a thick ductile build-up for electronics and electroforming, our copper processes eliminate surface micro-defects and provide an unbreakable bond for subsequent nickel and chrome layers.
Every Mepco copper system is formulated in our Lahore R&D laboratory and balanced for local water quality, workload, and line conditions. The result is a bath that is easy to control, highly ductile, and economical to run—backed by engineers who visit your plant to set it up and keep it in peak condition.
- Where It’s Used
UsedTrusted on Complex Geometries, Electrical Conductors, and Precision Engineered Components
Printed circuit boards and electronic connective hardware
Automotive parts requiring high-adhesion thermal barriers
Industrial rollers, cylinders, and electroforming components
Need a process that isn’t listed?
Our R&D laboratory develops customised formulations for your exact substrate and finish.
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