Nickel Plating Process
Cleaners and Inhibitors

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Copper Plating Processes

At Master Electroplating Company (EPCO), our Copper Plating Processes are engineered to deliver exceptional throw power, outstanding levelling capabilities, and unmatched adhesion on diverse metallic substrates. Whether utilized as a vital undercoat (strike layer) to improve the bond strength of subsequent nickel and chrome finishes, or applied in functional electrical and decorative applications, our copper formulations ensure a smooth, ductile, and uniform deposit. Developed under rigorous quality standards and backed by our ISO 9001:2000 certification, EPCO’s copper plating systems empower manufacturing facilities to achieve pristine surface finishes with maximum efficiency.

Ensures uniform thickness distribution even across complex geometries, deep recesses, and intricate component shapes
Smooths out microscopic surface imperfections, minimizing polishing time and creating a brilliant base for subsequent plating layers

Product Lines & Applications

Specialized Copper Plating Processes for Diverse Needs
Cyanide Copper Processes
Acid Copper Processes
Pyrophosphate Copper Processes

Pyrophosphate Copper Processes

A non-cyanide alternative providing excellent throwing power and compatibility with heat-sensitive or specialty substrates.

Acid Copper Processes

Designed for high-speed, thick copper deposits characterized by brilliant levelling and excellent mechanical properties, widely used in decorative and electroforming applications

Cyanide Copper Processes

Offers exceptional throwing power and superior adhesion, making it the ideal strike layer for difficult substrates like steel and zinc